Hispanic Scholarship Fund (HSF) and the Verizon Foundation offers Scholarship for Undergraduates and Postgraduate Hispanic Students to study in USA
Study Subject(s):Accounting, Business Administration , Finance , Human Resource Management , Management, Communications, Marketing, Telecommunications,Computer Engineering, Information Technology (IT/MIS), Electrical, Industrial, Mechanical Engineering
Course Level:Undergraduates, Postgraduates
Scholarship Provider: HSF/ Verizon Foundation
Scholarship can be taken at: USA
User Review
( votes)Eligibility:
-Be of Hispanic heritage
-Be a U.S. Citizen or a legal permanent resident with permanent resident card or passport stamped I-551 (not expired)
-Be an undergraduate sophomore, junior, or senior enrolled full-time in a degree
-seeking program at a four-year U.S. accredited college or university in the U.S., Puerto Rico, the U.S. Virgin Islands, or Guam
-Have a minimum cumulative grade point average (GPA) of 3.00 on a 4.00 scale
-Must attend an institution in one of the following states: California, Florida, New Jersey, New York, or Texas
-Must be majoring in one of the following: Accounting (New Jersey only), Business Administration (includes Sales and Commerce), Finance (New Jersey only), Human Resource Management (New Jersey only), Management (includes Retail Management), Communications, Marketing, Telecommunications,Computer Engineering, Information Technology (IT/MIS), Electrical, Industrial, or Mechanical Engineering
Scholarship Open for International Students: No
Scholarship Description:The Hispanic Scholarship Fund (HSF) and the Verizon Foundation have partnered to provide financial resources to assist outstanding Latino students. This scholarship is open to sophomore, junior and senior students in selected majors. The award amount is $5,000. Selected students will be invited to join the Verizon Student Network and may have the opportunity to participate in a summer internship.Applicants with disabilities are encouraged to apply.
How to Apply: By Post
Scholarship Application Deadline: July 20, 2011
