Tyndall National Institute at University College Cork is offering International PhD Position in Chiplet-Enabled Silicon Photonics. The project focuses on developing scalable, high-performance photonic-electronic systems using advanced chiplet integration and packaging technologies. The successful candidate will join a leading research team, receive a €25,000 annual stipend, and gain access to state-of-the-art facilities.

Applicants must hold a master’s degree in Physics, Engineering, Materials Science, or a related field, with at least a 2:1 or First-Class Honours at the undergraduate level. They should demonstrate strong motivation, teamwork, and communication skills. Prior experience in semiconductor packaging or photonics is desirable.

Tyndall National Institute is one of Europe’s leading research centers in integrated ICT hardware and systems. Located at University College Cork (UCC) in Ireland, Tyndall specializes in photonics, electronics, nanotechnology, and materials science. The institute is known for its cutting-edge research, strong industry collaborations, and state-of-the-art laboratory facilities.

Application Deadline: 2nd May 2025

Brief Description

• University or Organization: Tyndall National Institute, University College Cork

• Department: Photonics Packaging Research Group

• Course Level: PhD (Doctoral level)

• Award: Annual stipend of €25,000 for four years

• Access Mode: Online application

• Number of Awards: One

• Nationality: Domestic and international

• The award can be taken in: Ireland

Eligibility

• Eligible Countries: All nationalities are eligible to apply.

• Acceptable Course or Subjects: The scholarship will be awarded in photonic-electronic systems integration, semiconductor packaging, and related research fields.

• Admissible Criteria: To be eligible, applicants must meet the following criteria:

  • Hold a Master’s degree in Physics, Engineering, Materials Science, or a closely related discipline.

  • Have obtained at least a First-Class Honours Degree (2:1 or higher) at undergraduate level.

  • Demonstrate strong motivation, initiative, and ability to work both independently and collaboratively.

  • Possess good scientific writing and communication skills.

  • Experience in semiconductor packaging, optical modeling, or reliability tools is desirable.

  • Non-native English speakers must meet UCC’s English language proficiency requirements: UCC English Language Requirements.

How to Apply

Applicants must submit:

• An up-to-date CV/Resume

• A brief cover letter outlining how they meet the criteria.

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