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President Asia Scholarship at Academia Higher Education Colleges in Slovenia, 2017

Applications are invited from suitably qualified candidates for President’s Asia Scholarship. These scholarships are available to pursue undergraduate degree in Mechanical Engineering

The main purpose of the scholarships is to support Asian international students to complete a Mechanical Engineering Diploma programme at Academic Higher Education Colleges.

  • Award
  • Application Process
  • Clarity of Information


Excellent opportunity for international students

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Course Level: Scholarships are available to pursue an undergraduate degree.

Study Subject: Scholarships are awarded in the field of Mechanical Engineering.

Scholarship Award: Scholarships will cover the full tuition fees for international students who enrol full-time in a Mechanical Engineering Diploma Programme at the Academia

Numbers of Scholarships: Up to three scholarships are available.

Scholarship can be taken in Slovenia

Eligibility: Applicants must meet the following eligibility requirements:

  • Top International student from Asia
  • Studying an equivalent to Slovenian Year 12 or IB in 2017
  • Commencing a mechanical engineering program at Academia campus in Maribor, Slovenia

Nationality:  Applicants of Afghanistan, Bahrain, Bangladesh, Bhutan, Brunei, Cambodia, China, Georgia, India, Indonesia, Iran, Iraq, Israel, Japan, Jordan, Kazakhstan, Kuwait, Kyrgyzstan, Laos, Lebanon, Malaysia, Maldives, Mongolia, Myanmar, Nepal, North Korea, Oman, Pakistan, Papua New Guinea, Philippines, Qatar, Saudi Arabia, Singapore, South Korea, Sri Lanka, Syria, Taiwan, Tajikistan, Thailand, Turkmenistan, United Arab Emirates, Uzbekistan, Vietnam and Yemen are eligible for these scholarships.

College Admission Requirement

Entrance Requirement:  Applicants must have previous year degree.

English Language Requirement: Applicants must be proficient in English.

Undergraduate Scholarship

How to Apply: Application is made to the International Admissions Office.

Application Deadline: Closed

Scholarship Link